Tetraethyl Orthosilicate

TEOS

Ethylsilicate (TEOS) is used as the raw materials used in semiconductor technology deposition can be used for low pressure chemical vapor deposition (LPCVD) the surface of silica in SiC wafers deposits, ensure the density of the oxide layer medium and SiC wafers adhesion ability, improve the performance of the device and yield, and avoided in order to obtain a certain thickness of oxide layer of the shortcomings of long time high temperature oxidation.

TEOS

Tetraethyl Orthosilicate

TEOS is obtained by esterification of silicon tetrachloride and ethanol at normal temperature and pressure. TEOS tained by adsorption, distillation and filtration. Chem has reached strategic cooperation with major semiconductor companies, and can supply more than 1,200 tons of electronic-grade TEOS every year.

ProductTEOS
CAS No.78-10-4
Purity≥99.9%

Application

Semiconductors
Semiconductors
TEOS can be used for low pressure chemical vapor deposition (LPCVD) the surface of silica in SiC wafers deposits.

FAQs

Cylinder: 5 gallons Valve: 1/4’VCR Content: 17kg
Cylinder: 10 gallons Valve: 1/4’VCR Content: 34kg
Cylinder: 200L Valve: 1/4’VCR Content: 190kg

TEOS should be stored in a cool, dry and well-ventilated warehouse. Keep away from fire and heat sources. Storage temperature should not exceed 37°C. Keep container tightly closed. It should be stored separately from oxidants, acids, and alkalis, and should not be mixed. Explosion-proof lighting and ventilation facilities are adopted.

TEOS is often used to prepare heat-resistant and chemical-resistant coatings and organic silicon solvents. It can also be used in organic synthesis, basic raw materials for the preparation of advanced crystals, optical glass treatment agents, bonding agents, and insulating materials in the electronics industry.

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